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產品

賦能各行業創新,並持續爲創造更美好的未來貢獻力量

Lapping Film(LWF)

Lapping Film(LWF)

基材厚度:1mil = 25u / 3mil = 75u
粒度范围:400 - 20000

  • 描述

    將超微粒研磨材料均勻分散在薄膜膠片基材之上,均勻的分布,打磨時不會產生深的劃痕,可以獲得均勻的超精細表面處理。
    薄膜研磨材料具有豐富的柔韌性,抗拉伸、抗撕裂,適合自動化設備的拋光與耐久性的規模生產。

    聚酯薄膜,耐油、耐水,乾式、溼式研磨都可以使用。

    適用於金屬滾軸、光纖連接器、磁頭磁盤、微型電機、探針等各類的精密拋光、清洗加工。
    選擇本膠片,您可以輕鬆獲得高要求的精度。

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